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? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 1 benefts ? -30c to +85c operating temperature range ? lead (pb)-free, rohs and reach compliant ? eia 0402, 0603, 0805, 1206, and 1210 case sizes ? dc voltage ratings of 6.3 v, 10 v, 16 v, 25 v, and 50 v ? capacitance offerings ranging from 0.022 f to 22 f ? available capacitance tolerance of +80%/ -20% ? non-polar device, minimizing installation concerns ? 100% pure matte tin-plated termination fnish that allowing for excellent solderability applications typical applications include limited temperature, decoupling and bypass. overview kemets y5v dielectric features an 85c maximum operating temperature and is considered general-purpose. the electronics components, assemblies & materials association (eia) characterizes y5v dielectric as a class iii material. components of this classifcation are fxed, ceramic dielectric capacitors suited for bypass and decoupling or other applications in which dielectric losses, high insulation resistance and capacitance stability are not of major importance. y5v exhibits a predictable change in capacitance with respect to time and voltage and displays wide variations in capacitance with reference to ambient temperature. capacitance change is limited to +22%, -82% from -30c to +85c. surface mount multilayer ceramic chip capacitors (smd mlccs) y5v dielectric, 6.3 C 50 vdc (commercial grade) ordering information c 1210 c 226 z 4 v a c tu ceramic case size (l" x w") specifcation/ series capacitance code (pf) capacitance tolerance voltage dielectric failure rate/ design termination finish 1 packaging/grade (c-spec) 2 0402 0603 0805 1206 1210 c = standard 2 signifcant digits 1 additional termination fnish options may be available. contact kemet for details. 2 additional reeling or packaging options may be available. contact kemet for details. one world. one kemet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 2 dimensions C millimeters (inches) l b w s t eia size code metric size code l length w width t thickness b bandwidth s suwl llx xwl ltx 0402 1005 1.00 (.040) 0.05 (.002) 0.50 (.020) 0.05 (.002) see table 2 for thickness 0.30 (.012) 0.10 (.004) 0.30 (.012) solder refow only 0603 1608 1.60 (.063) 0.15 (.006) 0.80 (.032) 0.15 (.006) 0.35 (.014) 0.15 (.006) 0.70 (.028) solder wave or solder refow 0805 2012 2.00 (.079) 0.20 (.008) 1.25 (.049) 0.20 (.008) 0.50 (0.02) 0.25 (.010) 0.75 (.030) 1206 3216 3.20 (.126) 0.20 (.008) 1.60 (.063) 0.20 (.008) 0.50 (0.02) 0.25 (.010) n/a 1210 3225 3.20 (.126) 0.20 (.008) 2.50 (.098) 0.20 (.008) 0.50 (0.02) 0.25 (.010) solder refow only qualifcation/certifcation commercial grade products are subject to internal qualifcation. details regarding test methods and conditions are referenced in table 4, performance & reliability. environmental compliance lead (pb)-free, rohs, and reach compliant without exemptions (excluding snpb termination fnish option). surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 3 electrical parameters/characteristics item parameters/characteristics operating temperature range -30c to +85c capacitance change with reference to +25c and 0 vdc applied (tcc) +22%, -82% aging rate (maximum % capacitance loss/decade hour) 7.0% dielectric withstanding voltage (dwv) 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50 ma) dissipation factor (df) maximum limit @ 25oc 10% (6.3 and 10 v), 7% (16 and 25 v) and 5% (50 v) insulation resistance (ir) limit @ 25c see insulation resistance limit table (rated voltage applied for 120 5 seconds @ 25c) regarding aging rate: capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. to obtain ir limit, divide m-f value by the capacitance and compare to g limit. select the lower of the two limits. capacitance and dissipation factor (df) measured under the following conditions: 1 khz 50 hz and 1.0 0.2 vrms 120 hz 10 hz and 0.5 0.1 vrms if capacitance >10 f note: when measuring capacitance it is important to ensure the set voltage level is held constant. the hp4284 and agilent e4980 have a feature known as automatic level control (alc). the alc feature should be switched to "on." post environmental limits high temperature life, biased humidity, moisture resistance dielectric rated dc voltage capacitance value dissipation factor (maximum %) capacitance shift insulation resistance y5v > 25 all 7.5 30% 10% of initial limit 16/25 10.0 < 16 15.0 insulation resistance limit table eia case size 100 megohm microfarads or 10 g 50 megohm microfarads or 10 g all 16 v 10 v surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 4 table 1 C capacitance range/selection waterfall (0402 C 1210 case sizes) capacitance capacitance code case size/ series c0402c c0603c c0805c c1206c c1210c voltage code 9 8 4 9 8 4 3 9 8 4 3 5 9 8 4 3 5 9 8 4 3 5 rated voltage (vdc) 6.3 10 16 6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 capacitance tolerance product availability and chip thickness codes see table 2 for chip thickness dimensions 22,000 pf 223 m z bb bb bb cf cf cf cf dc dc dc dc dc 27,000 pf 273 m z bb bb bb cf cf cf cf dc dc dc dc dc 33,000 pf 333 m z bb bb bb cf cf cf cf dc dc dc dc dc 39,000 pf 393 m z bb bb bb cf cf cf cf dd dd dd dd dd 47,000 pf 473 m z bb2 bb1 bb1 cf cf cf cf dd dd dd dd dd 56,000 pf 563 m z bb bb bb cf cf cf cf dd dd dd dd dd 68,000 pf 683 m z bb bb bb cf cf cf cf dd dd dd dd dd 82,000 pf 823 m z bb bb bb cf cf cf cf dd dd dd dd dd 0.10 f 104 m z bb bb bb cg cg cg cg dc dc dc dc dc 0.12 f 124 m z cg cg cg cg dc dc dc dc 0.15 f 154 m z cg cg cg cg dc dc dc dc 0.18 f 184 m z cg cg cg cg dc dc dc dc 0.22 f 224 m z bb cg cg cg cg dc dc dc dc dg ec ec ec ec fd fd fd fd fd 0.27 f 274 m z cg cg cg cg dc dc dc dc eb eb eb eb fd fd fd fd fd 0.33 f 334 m z cg cg cg cg dc dc dc dc eb eb eb eb fd fd fd fd fd 0.39 f 394 m z cg cg cg dc dc dc dc eb eb eb eb fd fd fd fd fd 0.47 f 474 m z bb cg cg cg dc dc dc dc ec ec ec ec fd fd fd fd fd 0.56 f 564 m z cg cg dd dd dd dd eb eb eb eb fd fd fd fd fd 0.68 f 684 m z cg cg de de de de eb eb eb eb fd fd fd fd fd 0.82 f 824 m z cg cg dg dg dg dg eb eb eb eb ff ff ff ff ff 1.0 f 105 m z bb bb cg cg cg cg dg dg dg dg dg ef ef ef eg fh fh fh fh fh 1.2 f 125 m z dc dc dc ec ec ec fd fd fd 1.5 f 155 m z dc dc dc ec ec ec fd fd fd 1.8 f 185 m z dd dd dd ed ed ed fd fd fd 2.2 f 225 m z bb bb dg dg dg eh eh eh fj fj fj 3.3 f 335 m z dl dl dg eh eh eh fe fe fe 4.7 f 475 m z dg dg dg em em em ft ft ft 5.6 f 565 m z df df ej ej ej fg fg fg 6.8 f 685 m z dg dg ej ej fh fh fh 10 f 106 m z dg dg eh eh eh eh ft ft ft 15 f 156 m z fh fh fh 22 f 226 m z eh eh fh fh fh fh capacitance capacitance code rated voltage (vdc) 6.3 10 16 6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 voltage code 9 8 4 9 8 4 3 9 8 4 3 5 9 8 4 3 5 9 8 4 3 5 case size/ series c0402c c0603c c0805c c1206c c1210c surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 5 table 2 C chip thickness/packaging quantities thickness code case size thickness range (mm) paper quantity plastic quantity 7" reel 13" reel 7" reel 13" reel bb 0402 0.50 0.05 10,000 50,000 0 0 cf 0603 0.80 0.07 4,000 15,000 0 0 cg 0603 0.80 0.10 4,000 15,000 0 0 dc 0805 0.78 0.10 4,000 10,000 0 0 dd 0805 0.90 0.10 4,000 10,000 0 0 dl 0805 0.95 0.10 0 0 4,000 10,000 de 0805 1.00 0.10 0 0 2,500 10,000 df 0805 1.10 0.10 0 0 2,500 10,000 dg 0805 1.25 0.15 0 0 2,500 10,000 eb 1206 0.78 0.10 4,000 10,000 4,000 10,000 ec 1206 0.90 0.10 0 0 4,000 10,000 eh 1206 0.90 0.10 0 0 4,000 10,000 ed 1206 1.00 0.10 0 0 2,500 10,000 ef 1206 1.20 0.15 0 0 2,500 10,000 em 1206 1.25 0.15 0 0 2,500 10,000 eg 1206 1.60 0.15 0 0 2,000 8,000 ej 1206 1.70 0.20 0 0 2,000 8,000 fd 1210 0.95 0.10 0 0 4,000 10,000 fe 1210 1.00 0.10 0 0 2,500 10,000 ff 1210 1.10 0.10 0 0 2,500 10,000 fg 1210 1.25 0.15 0 0 2,500 10,000 fh 1210 1.55 0.15 0 0 2,000 8,000 fj 1210 1.85 0.20 0 0 2,000 8,000 ft 1210 1.90 0.20 0 0 1,500 4,000 thickness code case size thickness range (mm) 7" reel 13" reel 7" reel 13" reel paper quantity plastic quantity package quantity based on fnished chip thickness specifcations. surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 6 table 3 C chip capacitor land pattern design recommendations per ipc-7351 eia size code metric size code density level a: maximum (most) land protrusion (mm) density level b: median (nominal) land protrusion (mm) density level c: minimum (least) land protrusion (mm) c y x v1 v2 y x v1 v2 y x v1 v2 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1210 1 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1 only for capacitance values 22 f density level a: for low-density product applications. recommended for wave solder applications and provides a wider process window for refow solder processes. kemet only recommends wave soldering of eia 0603, 0805, and 1206 case sizes. density level b: for products with a moderate level of component density. provides a robust solder attachment condition for refow solder processes. density level c: for high component density product applications. before adapting the minimum land pattern variations the user should perform qualifcation testing based on the conditions outlined in ipc standard 7351 (ipcC7351). image below based on density level b for an eia 1210 case size. y c c x x v1 v2 grid placement courtyard y surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 7 soldering process recommended soldering technique: ? solder wave or solder refow for eia case sizes 0603, 0805 and 1206 ? all other eia case sizes are limited to solder refow only recommended refow soldering profle: kemets families of surface mount multilayer ceramic capacitors (smd mlccs) are compatible with wave (single or dual), convection, ir or vapor phase refow techniques. preheating of these components is recommended to avoid extreme thermal stress. kemets recommended profle conditions for convection and ir refow refect the profle conditions of the ipc/j-std-020 standard for moisture sensitivity testing. these devices can safely withstand a maximum of three refow passes at these conditions. profle feature termination finish snpb 100% matte sn preheat/soak time within 5c of maximum peak temperature (t p ) 20 seconds maximum 30 seconds maximum ramp-down rate (t p to t l ) 6c/second maximum 6c/second maximum time 25c to peak temperature 6 minutes maximum 8 minutes maximum note 1: all temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly refow. time temperature t smin 25 c to peak t l t s 25 t p t smax t l t p maximum ramp up rate = 3 c/sec maximum ramp down rate = 6 c/sec surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 8 table 4 C performance & reliability: test methods and conditions stress reference test or inspection method terminal strength jisCcC6429 appendix 1, note: force of 1.8 kg for 60 seconds. board flex jisCcC6429 appendix 2, note: standard termination system C 2.0 mm (minimum) for all except 3 mm for c0g. flexible termination system C 3.0 mm (minimum). solderability jCstdC002 magnifcation 50 x. conditions: a) method b, 4 hours @ 155c, dry heat @ 235c b) method b @ 215c category 3 c) method d, category 3 @ 260c temperature cycling jesd22 method jaC104 1,000 cycles (-55c to +125c). measurement at 24 hours +/- 2 hours after test conclusion. biased humidity milCstdC202 method 103 load humidity: 1,000 hours 85c/85% rh and rated voltage. add 100 k ohm resistor. measurement at 24 hours +/- 2 hours after test conclusion. low volt humidity: 1,000 hours 85c/85% rh and 1.5 v. add 100 k ohm resistor. measurement at 24 hours +/- 2 hours after test conclusion. moisture resistance milCstdC202 method 106 t = 24 hours/cycle. steps 7a and 7b not required. unpowered. measurement at 24 hours +/- 2 hours after test conclusion. thermal shock milCstdC202 method 107 -55c/+125c. note: number of cycles required C 300, maximum transfer time C 20 seconds, dwell time C 15 minutes. air C air. +ljk 7hpshudwuh /lih 0,/67 0hwkrg /eiaC198 kruv dw iru 5 =8 dg <9 zlwk udwhg yrowdjh dssolhg storage life milCstdC202 method 108 150c, 0 vdc for 1,000 hours. vibration milCstdC202 method 204 5 g's for 20 min., 12 cycles each of 3 orientations. note: use 8" x 5" pcb 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. parts mounted within 2" from any secure point. test from 10 C 2,000 hz 0hfkdlfdo 6krfn 0,/67 0hwkrg )ljuh ri 0hwkrg rglwlr ) resistance to solvents milCstdC202 method 215 add aqueous wash chemical, okem clean or equivalent. storage and handling ceramic chip capacitors should be stored in normal working environments. while the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. in addition, packaging materials will be degraded by high temperatureC reels may soften or warp and tape peel force may increase. kemet recommends that maximum storage temperature not exceed 40oc and maximum storage humidity not exceed 70% relative humidity. temperature fuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. for optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 9 construction dielectric material (batio 3 ) detailed cross section barrier layer (ni) base metal (cu) inner electrodes (ni) termination finish (100% matte sn) barrier layer (ni) base metal (cu) termination finish (100% matte sn) inner electrodes (ni) dielectric material (batio 3 ) capacitor marking (optional): laser marking option is not available on: ? c0g, ultra stable x8r and y5v dielectric devices ? eia 0402 case size devices ? eia 0603 case size devices with flexible termination option. ? kps commercial and automotive grade stacked devices. these capacitors are supplied unmarked only. surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 10 tape & reel packaging information kemet offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with eia standard 481. this packaging system is compatible with all tape-fed automatic pick and place systems. see table 2 for details on reeling quantities for commercial chips. 8 mm, 12 mm or 16 mm carrier tape 178 mm (7.00") or 330 mm (13.00") anti-static reel embossed plastic* or punched paper carrier. embossment or punched cavity anti-static co v er t ape (.10 mm (.004") maximum thic kness) chip and kps or ientation in p oc k et (e xcept 1825 commercial, and 1825 and 2225 milita r y) *eia 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. kemet ? bar code label sprocket holes table 5 C carrier tape conf guration C embossed plastic & punched paper (mm) eia case size tape size (w)* pitch (p 1 01005 C 0402 8 2 0603 C 1210 8 4 1805 C 1808 12 4 1812 12 8 kps 1210 12 8 kps 1812 & 2220 16 12 array 0508 & 0612 8 4 *refer to figures 1 & 2 for w and p carrier tape reference locations. *refer to tables 6 & 7 for tolerance specif cations. surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 11 figure 1 C embossed (plastic) carrier tape dimensions p o t f w c en t er li n e s of cav i t y a o b o u s e r d i r e c t i o n o f u n r e elin g c ov er t ap e k o b 1 i s f or t ap e f e ed er r e f e r ence onl y, i ncl u di ng dr a ft con c en t r i c a bou t b o . t 2 ? d 1 ? d o b 1 s 1 t 1 e 1 e 2 p 1 p 2 e m b os s m e nt f or c a v i t y s i z e , s e e n o t e 1 t a b l e 4 [ 1 0 p i t c h e s c um u l at i v e t ol er a n c e o n t a p e 0. 2 m m ] 7deoh2(pervvhg3odvwlf&duulhu7dsh'lphqvlrqv metric will govern constant dimensions millimeters (inches) tape size d 0 d 1 minimum note 1 e 1 p 0 p 2 r reference note 2 s 1 minimum note 3 t maximum t 1 maximum 8 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 1.0 (0.039) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 12 mm 1.5 (0.059) 30 (1.181) 16 mm variable dimensions millimeters (inches) tape size pitch b 1 maximum note 4 e 2 minimum f p 1 t 2 maximum w maximum a 0 ,b 0 & k 0 8 mm single (4 mm) 4.35 (0.171) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 4.0 0.10 (0.157 0.004) 2.5 (0.098) 8.3 (0.327) note 5 12 mm single (4 mm) & double (8 mm) 8.2 (0.323) 10.25 (0.404) 5.5 0.05 (0.217 0.002) 8.0 0.10 (0.315 0.004) 4.6 (0.181) 12.3 (0.484) 16 mm triple (12 mm) 12.1 (0.476) 14.25 (0.561) 7.5 0.05 (0.138 0.002) 12.0 0.10 (0.157 0.004) 4.6 (0.181) 16.3 (0.642) 1. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 2. the tape with or without components shall pass around r without damage (see figure 6). 3. if s 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see eia standard 481 paragraph 4.3 section b). 4. b 1 dimension is a reference dimension for tape feeder clearance only. 5. the cavity def ned by a 0 , b 0 and k 0 shall surround the component with suff cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see figure 4). (e) for kps series product, a 0 and b 0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in eia standard 481 for standards relating to more precise taping requirements. surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 12 figure 2 C punched (paper) carrier tape dimensions u s e r d i r e c t ion of u n r eelin g t o p c o v e r t ape t c e n t e r l ines o f c a v i t y p 1 ? d o p o p 2 e 1 f e 2 w g a 0 b 0 c a v i t y s i z e , s e e n ote 1, tabl e 7 b o t t o m c o v e r t a p e t 1 t 1 b o t t o m c o v e r t a p e [10 p it c hes c u mu l a t i v e t o le r a n c e o n t a p e 0 . 2 m m] 7deoh23xqfkhg3dshu&duulhu7dsh'lphqvlrqv metric will govern constant dimensions millimeters (inches) variable dimensions millimeters (inches) pitch e2 minimum f p 1 t maximum w maximum a 0 b 0 8 mm half (2 mm) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.079 0.002) 1.1 (0.098) 8.3 (0.327) note 1 8 mm single (4 mm) 4.0 0.10 (0.157 0.004) 8.3 (0.327) 1. the cavity def ned by a 0 , b 0 and t shall surround the component with suff cient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see figure 4). e) see addendum in eia standard 481 for standards relating to more precise taping requirements. 2. the tape with or without components shall pass around r without damage (see figure 6). surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 13 packaging information performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia standards 556 and 624 . figure 3 C maximum component rotation a o b o t s maxi m u m c ompone n t r o t a tio n t op v i e w m a x i mum c o mponent r o t a t ion s ide v i e w t a p e m axi m u m width (mm) r otati o n ( t ) 8,12 2 0 16 ? 200 1 0 t a p e m a x i m u m widt h ( mm) r o tati o n ( s ) 8,12 20 16 ? 56 1 0 72 ? 200 5 t y p ic a l p o c k e t cente r line t y p i c a l c o m pon e n t c e n t e r l i n e figure 4 C maximum lateral movement 0 . 5 m m m a x i mum 0 . 5 m m m a x i mum 8 m m & 1 2 m m tape 1 . 0 m m m a x i mum 1 . 0 m m m a x i mum 1 6 m m t a p e figure 5 C bending radius r r b end i n g r a d i u s e mbo ssed c a r r i e r p unc hed c a rrier surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 14 figure 6 C reel dimensions a d (see n o te ) full r a d i us, see n o t e b ( s ee note) access h o le at s l o t loc a ti on (? 40 m m mi nimum) i f p r es en t, tape slot i n core for t ape start: 2.5 mm minimum wi dt h x 10.0 mm mi n imum dep th w 3 (incl u des flan g e dis to r tion at out e r e dge) w 2 ( m eas u re d a t hub ) w 1 ( m eas u re d a t hub ) c (arbor hol e di a m e ter ) note: driv e spok es o ptiona l ; if u s ed, d i mensi o ns b an d d shall a pply. n 7deoh25hho'lphqvlrqv metric will govern constant dimensions millimeters (inches) variable dimensions millimeters (inches) shall accommodate tape width without interference 12 mm 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 18.4 (0.724) 16 mm 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 22.4 (0.882) surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 15 figure 7 C tape leader & trailer dimensions t r a i le r 160 mm min imum c a r r i e r t ape e n d s t a r t r o und s p rocke t h o l e s e l ongated s p r o cke t h o l e s ( 32 mm tape and w i der ) t op c o ver t ape top c over t ape p unched c a r r i e r 8 mm & 12 m m o n l y e mboss ed c a r r i e r c o m p o n e n t s 1 0 0 m m m i n imum leader 4 0 0 mm m i n i m u m figure 8 C maximum camber c a r r i e r t a p e r o u n d s p r o c k e t h ol e s 1 m m max i m u m , e i t h e r d i r e c t i o n s t r ai gh t edge 2 5 0 m m e l o n g a t ed s p r oc k e t h ol e s ( 32 m m & w ide r t a pes ) figure 9 C bulk cassette packaging (ceramic chips only) meets dimensional requirements iecC286 and eiaj 7201 unit mm *reference 1 10 0.7 31.5 0 0.2 36 0 0.2 19.0* 5 0* 10* 53 3* 6 8 0.1 8 8 0.1 12. 0 0.1 3.0 0 0.2 2.0 0.1 0 1.5 0 0.1 table 9 C capacitor dimensions for bulk cassette cassette packaging C millimeters eia size code metric size code l length w width b bandwidth s separation minimum t thickness number of pieces/cassette 0402 1005 1.0 0.05 0.5 0.05 0.2 to 0.4 0.3 0.5 0.05 50,000 0603 1608 1.6 0.07 0.8 0.07 0.2 to 0.5 0.7 0.8 0.07 15,000 surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 16 kemet corporation world headquarters 2835 kemet way simpsonville, sc 29681 mailing address: p.o. box 5928 greenville, sc 29606 www.kemet.com tel: 864-963-6300 fax: 864-963-6521 corporate off ces fort lauderdale, fl tel: 954-766-2800 north america southeast lake mary, fl tel: 407-855-8886 northeast wilmington, ma tel: 978-658-1663 central novi, mi tel: 248-306-9353 west milpitas, ca tel: 408-433-9950 mexico guadalajara, jalisco tel: 52-33-3123-2141 europe southern europe paris, france tel: 33-1-4646-1006 sasso marconi, italy tel: 39-051-939111 central europe landsberg, germany tel: 49-8191-3350800 kamen, germany tel: 49-2307-438110 northern europe bishops stortford, united kingdom tel: 44-1279-460122 espoo, finland tel: 358-9-5406-5000 asia northeast asia hong kong tel: 852-2305-1168 shenzhen, china tel: 86-755-2518-1306 beijing, china tel: 86-10-5829-1711 shanghai, china tel: 86-21-6447-0707 taipei, taiwan tel: 886-2-27528585 southeast asia singapore tel: 65-6586-1900 penang, malaysia tel: 60-4-6430200 bangalore, india tel: 91-806-53-76817 note: kemet reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. kemet does not assume any responsibility for infringement that might result from the use of kemet capacitors in potential circuit designs. kemet is a registered trademark of kemet electronics corporation. surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1005_y5v_smd ? 6/6/2014 17 disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. surface mount multilayer ceramic chip capacitors (smd mlccs) C y5v dielectric, 6.3 C 50 vdc (commercial grade)

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